Requirement of multiple Lap and Polish Tools

The National Research Council Canada (NRC) has a requirement for multiple lapping and polishing tools to support the CPFC’s modernization to 4” wafer processing capability. Lapping and polishing equipment are mission critical for a photonics foundry producing waveguides, modulators, lasers, filters, or integrated photonic circuits. These tools ensure substrate flatness, surface quality, and thickness uniformity, all of which directly affect optical performance, coupling efficiency, and device yield. The CPFC has a requirement to update its aging lapping and polishing tools degrade as they currently contribute to manufacturing risks to yield, optical performance, process stability, and throughput. Replacing aging tools is essential to maintain foundry grade capability, support customer programs, and prevent production interruptions as the CPFC progresses to 4” wafer processing capability. The CPFC requires the procurement of: o Three (3) Modular Wafer Bonding System o One (1) LP70 multi-station lapping and polishing system o One (1) PP6GT Precision Polishing Jig with Vacuum adaptor o One (1) CG10 Contact Measurement Gauge o One (1) Solvent Vapour Cleaner NRC is investing in semiconductor fabrication infrastructure and related research capabilities to strengthen Canada’s compound semiconductor innovation and commercialization pipeline. As part of this initiative, the Canadian Photonics Fabrication Centre (CPFC) is transitioning to a 4” wafer processing photonics foundry which includes the modernization of its aging lapping and polishing equipment. These upgrades will enable CPFC to deliver photonic devices with tightly controlled variability in critical parameters (roughness, thickness, flatness, etc) and tightened tolerance specifications (facet polishing, high-flatness bonding surfaces) while decreasing maintenance costs and downtime.